Dr. Paul S. Ho is the Director of the Laboratory for Interconnect and Packaging at The University of Texas at Austin. He received his B.S. degree in mechanical engineering at National Chengkung University, Taiwan; M.S. degree in physics at National Tsinghua University, Taiwan; and Ph.D. degree in physics Rensselaer Polytechnic Institute. He joined the Materials Science and Engineering Department at Cornell University in 1966 and became an Associate Professor in 1972. In 1972, he joined the IBM T.J. Watson Research Center and has held a number of management positions. In 1985, he became Senior Manager of the Interface Science Department. In 1991, he joined the faculty at The University of Texas and was appointed the Cockrell Family Regents Chair in Materials Science and Engineering. His current research is in the areas of materials and processing science for interconnect and packaging applications. He holds the inventorship of 10 U.S. Patents in microelectronics technology. He has edited six books and published extensively in the area of thin films and materials science for microelectronics. He is a Fellow of the American Physical Society and the American Vacuum Society.